Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
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Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Articolo #: 228106567

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

Articolo #: 228106567

€ 13

Price Details

Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )

*All items will import from Regno Unito

In magazzino
Regno Unito Importato dal negozio UK

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Ordina subito e indossalo Giovedì, Agosto 06
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Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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Cosa salta all'occhio

Diseño compacto
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
Materiale di alta qualità
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.

Dettagli del prodotto

Shop Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel online at a best price in Italia. B0GZVVW343
  • [FOUR PITCHES] Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
  • [PRECISE POSITIONING] Tin mesh solder template allows fast and precise tin implantation without shifting under high temperatures, making reballing effortless and efficient.
  • [COMPACT APPEARANCE] With a and compact design, the BGA reballing stencil is portable and easy to use, providing convenience without compromising on quality.
  • [VERSATILE USAGE] This stencil is suitable for a variety of common IC chips found in phones today, meeting all your reballing needs with its wide compatibility.
  • [DURABLE MATERIAL] Crafted from premium stainless steel, the tin mesh solder template boasts durability and longevity, ensuring reliable performance for long-term use.
MarcaEminchu
Componentes incluidosNo
Número de modeloEminchu8g43mcizpy (2141.2 cm)
Número de parteEminchu8g43mcizpy (2141.2 cm)
Unidad de conteo1.0 Conteo
País de origenCina
FabricanteEminchu
Peso del artículo1 libbra (450 grammi)

A chi è consigliato?

Suitable For
  • Mobile Repair Technicians

    Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.

  • DIY Electronics Enthusiasts

    Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.

  • Small Repair Shops

    Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.

Not Suitable For
  • Mass Production Facilities

    Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.

  • Amateur Hobbyists

    Not recommended for beginners who may struggle with the precision required for effective BGA reballing without experience.

  • General Consumer Use

    Not for everyday consumers as it requires technical skills beyond basic user capabilities for effective application.

DESCRIZIONE DEL PRODOTTO

Hai qualche domanda? chatta con noi

Domande e risposte dei clienti

  • domanda: What pitch options does the stencil offer?

    Rispondere: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm.
  • domanda: Is the stencil easy to transport?

    Rispondere: Yes, the compact and elegant design makes it portable and easy to use.
  • domanda: What materials is the stencil made from?

    Rispondere: The stencil is made from premium stainless steel, ensuring durability and longevity.

Eminchu Templates Editorial Review

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Recensioni e valutazioni del cliente

5.0
1 valutazioni dei clienti
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€ 13

Ordina subito e indossalo Giovedì, Agosto 06

QTY:

Secured transactionsecured transaction

PCI DSS compliant and ISO 27001:2022 certified, with encrypted payments and full buyer protection on every order.

I nostri principali partner logistici
  • fedex
  • dhl
Consegna transfrontaliera più veloce

Caratteristiche e benefici

  • Four pitch options for versatile and accurate soldering.
  • Fast and precise tin implantation without displacement.
  • Elegant, compact, and portable design for easy use.
  • Compatible with a variety of common IC chips.
  • Crafted from durable stainless steel for long-term reliability.
  • Ideal for efficient BGA IC chip repair.

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